The semiconductor industry is undergoing a transformation as 3D integrated circuits (ICs) and heterogeneous packaging become mainstream. With these advances comes the promise of higher functional ...

As the industry transitions toward advanced 3D IC architectures and heterogeneous integration, managing thermo-mechanical stress is essential for product quality and long-term reliability. Calibre ...

Data sources Five online databases (PubMed, CINAHL, PsychInfo, SportDiscus and Web of Science) searched from inception through 14 September 2023. Hand-searches and contacting authors for eligible ...

Download PDF More Formats on IMF eLibrary Order a Print Copy Create Citation This paper uses text analysis to construct a continuous financial stress index (FSI) for 110 countries over each quarter ...

The rapid adoption of 3D integrated circuits (ICs) and heterogeneous packaging heralds a new era in semiconductor design. Benefits are clear: greater functional density, reduced footprint, and ...

A few guidelines show how to correctly use FEA stresses to find reasonable margins of safety. Although finite-element analysis has become an indispensable part of engineering, a few users knock it ...

Thin films form the basis of many industries today, including semiconductors, electric vehicles, smart optical coatings, sophisticated medical equipment, and protective layers on high-temperature ...