Advanced packaging technologies are reshaping how compute platforms are conceived, optimized, and manufactured.

Designers are utilizing an array of programmable or configurable ICs to keep pace with rapidly changing technology and AI.

Why it's essential to combine sign-off accuracy, iterative feedback, and intelligent automation in complex designs.

As chip designs become larger and more complex, especially for AI and high-performance computing workloads, it’s often not ...

Ensuring that verification platforms can scale with industry demands and support new use cases as they emerge.

In today’s fast-paced electronics design automation (EDA) environment, effective data management has become essential.

Accurate and efficient thermal modeling for 2.5D/3D heterogeneous chiplet systems” was published by researchers at EPFL and ...

A new technical paper titled “Effects of Proton Radiation on Tin Oxide: Implications for Space Electronics” was published by ...

Researchers from the University of Southern California Information Sciences Institute and the University of Wisconsin-Madison ...

An agentic AI-based approach to end-to-end bug resolution using both error logs and waveforms.

Driven On-Chip Integration for High Density and Low Cost” was published by researchers at University of Southern California.

A new technical paper titled “LLM-based Behaviour Driven Development for Hardware Design” was published by researchers at ...